Thermal Stress Modeling In Microelectronics and Photonic Structures, and the Application of the Probablistic Approach: Review and Extension

Elevated thermal stresses and deformations can result in a mechanical (structural), as well as in a functional (electrical or optical), failure of an electronic or photonic material, structure or package. Predictive modeling, whether analytical (“mathematical”) or numerical (typically, Finite Element), is an effective research/engineering tool for the prediction of the level and the adverse consequences of thermal stresses and deformations. Accordingly, in this review, the author discusses the major attributes of the predictive modeling of the thermal stresses in microelectronics and photonics packaging. In addition, the role that a probabilistic approach might play for understanding the effect of the variability/uncertainty in materials properties, structural geometry, and loading conditions on the thermal stress has been indicated. Based on several practical examples, one can demonstrate that, in some practically important problems of packaging engineering, when such a variability/uncertainty cannot be ignored, the application of a probabilistic approach can be very helpful in the analysis and design of a viable and reliable structure. The review is based primarily on the author’s research conducted at Bell Laboratories during the last decade.